Approximately 7% of the world's gold can be found inside discarded electronic devices, in form of PCB Gold Fingers. While a tonne of Gold Ore produces just 5 grams of pure gold on average, a tonne of electronic scrap can house 300 grams of gold inside it. Here we gloss over the significance of gold fingers in the present day electronics industry and all kinds of gold fingers specifications you need to know.
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Printed Circuit Boards (PCBs) provide the foundation for the assembly of electronic components and enable the functionality of a wide range of devices. This article journeys through the requisite steps in the PCB manufacturing process, detailing the procedures involved in each.
Announcing TechBlick's free-to-attend virtual conference and exhibition covering innovations in Wearable Sensors | E-Textiles | Printed Electronics & Beyond. It is a unique event with two-parallel live tracks, a live engaging exhibition floor, and 400+ attendees. See details & registration link here
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A unique new approach of printing functional materials with unparallel precision and repeatability. Technology called Ultra-Precise Deposition (UPD) is a nanodispensing method capable to print high density and high viscous materials with the resolution down to 1 µm in feature size and with high ratio of width to height after single pass. For this method material extrusion is controlled by a pressure, which means it is not supported with high electric field. Thanks to this there are no limitation if the substrate is conductive or dielectric.
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As wearable electronic devices continue to be more prevalent, it becomes an ever-greater challenge for companies that manufacture them to keep their competitive edge. It is vitally important for manufacturers that each device is effective, cost-efficient and reflects the highest quality available.
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EHD is a promising digital printing technology for going beyond the resolution limits of inkjet. Most examples showcase electronic or display related applications.
Nano-Ops is commercialising an automated wafer-based process and fab-in-a-box based on the directed assembly technology which can 'print' features down to 20nm. Here, In the first step a pattern is first etched into a template wafer.
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To scale up microLED displays to large areas, smaller displays can be titled. Because microLEDs can be truely edge-less devices, the tiling can function, yielding a seemless look.
Stretchable Electronics and inks for durable wearable electronics. These inks can be printed on TPU films which can be bonded to fabrics. This results in devices that stretch without cracking and maintain excellent electrical properties. Examples include biometric sensors & fixed resistance heaters
Silver nanoparticle inks improve every year. These improvements are often incremental, but very important. One ever-present direction of development is towards inks which offer ever higher conductivity levels at a low curing temperature and a short curing time. This a critical figure of merit because it opens more substrate choices, saves time, and lowers energy consumption costs.
This article explores the key differences between active and passive filters, detailing their transfer functions, frequency responses, components, circuit configurations, stability, design challenges, approximation methods, and CAD tools for filter simulation and optimization.
Circuit card assemblies (CCA) give birth to a complete printed circuit board (PCB) after assembling every component. A printed circuit board has no electrical components and needs to go through a manufacturing process called circuit card assemblies which are the complete board assembly.
Carnegie Mellon University collaborators pioneer the CMU Array—a customizable, 3D nano-printed, ultra-high-density microelectrode array platform for next-generation brain-computer interfaces. This technology can transform the way doctors are able to treat neurological disorders.
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Printed batteries offer thinness and flexibility, enabling new applications, but their production is deceivingly complex. Gunter Hübner from Stuttgart Media University offered some insights at the e-Swiss conference last week.
Experimenting in the world of Flexible Hybrid Electronics (FHE) comes with a variety of hurdles. Printing technologies are vastly different in terms of materials compatibility and have pros and cons that make them suitable for particular applications. Choosing materials that match the printing technology you intend to use is the most important decision you’re going to make. But what if one could print, digitally, using any paste and ink on any substrate? Read more
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