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Additive electronics is intrinsically more sustainable than subtractive processes. Yet the current materials are often based on metallic inks and plastic substrates. This is a particular issue in medical wearables with disposable devices. Hence the need to develop sustainable material options
4 minutes read
Mass manufacturing electronic textiles and in doing so combining textile based wiring and sensors with PCB electronics is no easy task. In this article, you will learn about an innovative approach to enable embriodery of PCBs and conductive wiring/sensors in mass produced e-textiles
3 minutes read
Die attach, also known as die bonding or die mount, is a process used in the semiconductor industry to attach a silicon chip to the die pad of a semiconductor package's support structure, such as a leadframe or metal can header. This article explores the fundamentals of die attach, its importance, materials, and methods used in die attach, its parameters, quality, and reliability techniques.
Step into the cutting-edge technologies and future trends of flexible and printed electronics.
This free-to-attend, immersive virtual event, on 22 June 2023 will cover all aspects of flexible and printed electronics, from material advancements to the development of novel deposition and manufacturing technologies.
TechBlick's presentation reviews printed electronics' industrial applications, dispelling the notion that it's solely a technology of the future. The talk showcases various commercial success stories incl. photovoltaics, displays, sensors, HMIs, 3D electronics, MLCCs, PCBs, semicon packaging, etc
First-of-its-kind demonstration suggests a more environmentally friendly future for the electronics industry is possible
A novel stretchable film has been developed for soft & stretchable circuit / electronic solutions, outperforming existing films like TPU. Here you can learn about case studies showcasing its potential in pliable PCBs, stretchable hybrid PCBs, and truly stretchable electronics.
3 minutes read
Castellated holes are extensively used in the printed circuit board (PCB) design process. This article is a detailed overview of castellated holes, covering their history, application, benefits, design attributes, challenges, and significance in modern electronic design.
In this article+talk, electrical 3D printing's technical aspects are covered, covering resin printing, circuit formation, part mounting, materials, and methods. Learn about low-temperature soldering, embedded components, and the impact on rapid prototyping and unique device manufacturing.
2 minutes read
Filled vias are via holes that are completely filled and closed with conductive or non-conductive material or copper plating. The filled via is one of the many realizations of PCB via covering, specified by industry standards. This article covers the definition, benefits, processes, applications, and challenges of filled vias.
Testing PCBs involves using various methods and tools to ensure that all the individual elements of a PCB perform optimally, making up a high-quality PCB assembly. This article delves into the methods, procedures, and requirements of PCB testing.
PCB Panelization is a PCB manufacturing technique. It involves the grouping of several small printed circuit boards to form a single array, which is known as a panel. Panelization is commonly employed in PCB manufacturing because it saves time and cost. This article discusses the conditions, design considerations, methods, types, and benefits of PCB panelization.
In this article, we will go over everything you need to know about PCB stencils.
This article aims to provide a comparative analysis of HASL vs ENIG, providing valuable insights to aid in making informed decisions for PCB design and manufacturing.
