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Thin film deposition is a process used to create thin film coatings on different materials. Thin films can consist of metal, semiconductors, and dielectrics, providing them with different properties. These properties translate to benefits such as electrical insulation, optical transmission, and corrosion resistance, that can be used to improve substrate performance. This article explores the processes of thin film deposition, along with its types, parameters, benefits, drawbacks, and applications.
Filled vias are via holes that are completely filled and closed with conductive or non-conductive material or copper plating. The filled via is one of the many realizations of PCB via covering, specified by industry standards. This article covers the definition, benefits, processes, applications, and challenges of filled vias.
PCB Panelization is a PCB manufacturing technique. It involves the grouping of several small printed circuit boards to form a single array, which is known as a panel. Panelization is commonly employed in PCB manufacturing because it saves time and cost. This article discusses the conditions, design considerations, methods, types, and benefits of PCB panelization.
Controlled impedance in printed circuit boards involves the regulation of resistance exerted by signal traces. It is determined by characteristic factors of PCB fabrication, such as trace width and copper thickness. This article discusses controlled impedance and the essentials of its execution in PCB manufacturing.