Die attach, also known as die bonding or die mount, is a process used in the semiconductor industry to attach a silicon chip to the die pad of a semiconductor package's support structure, such as a leadframe or metal can header. This article explores the fundamentals of die attach, its importance, materials, and methods used in die attach, its parameters, quality, and reliability techniques.
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Fifteen percent of electronic parts disappear from the market annually. Are you ready if one of them affects your design?
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This article provides a detailed overview of the solder reflow process, types of reflow ovens, temperature profiles, solder paste composition and selection, reflow process potential challenges, solutions, inspection, and quality control techniques.
This guide dives deep into the world of PCB surface finishes: In this article, you will experience a comprehensive analysis of various types, factors for optimal performance, and comparing different PCB finishes to choose right one for your specific application
Understanding Plasma Etching: Detailed Insights into Its Techniques, Uses, and Equipment Maintenance
Plasma etching is a salient process in various engineering fields, especially in electronics and materials science. It's a method used to etch or carve fine patterns on the surface of substrates, such as silicon wafers used in semiconductor manufacturing. It works by creating a plasma or ionized gas within a chamber, which chemically reacts with the material on the substrate's surface, effectively removing it. Plasma etching is highly precise and allows for the creation of extremely intricate patterns at a microscopic level.
Printed Circuit Boards (PCBs) are an essential component of nearly every electronic device, providing the foundation for the connections and features that enable functionality. As technology advances and devices become more complex, the importance of efficient and effective PCB layout design has become increasingly critical. This article will guide you through designing a PCB layout, from understanding the basics to mastering advanced techniques and preparing for manufacturing.
Picking the right fastener can be tricky.
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UART and SPI are key communication methods in electronics. UART is ideal for simple, long-distance connections, while SPI excels in fast data transfer. Used in GPS modules, SD cards, and microcontrollers, understanding their differences can help you choose the best for any given project.
Thermal analysis can identify key areas of temperature risk. Learn design strategies for coping with and dissipating excess heat.
2 minutes read
The purpose of this article is to provide a comprehensive, in-depth guide to PCB soldermask, exploring the key concepts, principles, and practical applications that will help you excel in PCB design and manufacturing.
New fabs will focus on making cutting-edge chips, not those based on older, established technology. So how should your company solve for potential limited supplies?
4 minutes read
Tented via is a crucial aspect of printed circuit board (PCB) design and manufacturing, playing a significant role in ensuring the reliability and performance of modern electronic devices. This comprehensive guide will provide you with an in-depth understanding of tented via technology, its importance in PCB design, and the various processes involved in creating and manufacturing tented vias.
Find out the drivers and challenges that are facing the industrial robotics industry
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Castellated holes are extensively used in the printed circuit board (PCB) design process. This article is a detailed overview of castellated holes, covering their history, application, benefits, design attributes, challenges, and significance in modern electronic design.
Many companies are now looking at alternatives to silicon chips.
5 minutes read
