Semiconductor manufacturers are providing more support to engineers to support in the design of highly complex electronic systems. The tools include highly detailed models of semiconductor devices, interactive application notes, quick learning videos and a handbook designed specifically for power electronics engineers.
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Review of industrial applications of printed electronics - what are current successful applications?
TechBlick's presentation reviews printed electronics' industrial applications, dispelling the notion that it's solely a technology of the future. The talk showcases various commercial success stories incl. photovoltaics, displays, sensors, HMIs, 3D electronics, MLCCs, PCBs, semicon packaging, etc
SystemVerilog is the industry's leading hardware description and verification language (HDVL), offering a unified solution for digital system design and verification. This article delves into the fundamentals of SystemVerilog, highlighting its origins, key differences from Verilog, essential language elements, design constructs, and powerful verification features.
Wafer Probing is an electrical testing process conducted on semiconductor wafers after the integrated circuits are applied to the wafers. This is an essential step in the semiconductor manufacturing process that helps to determine the functionality of wafers and overall production quality. This article explores the process, importance, types, and applications of wafer probing.
Thin film deposition is a process used to create thin film coatings on different materials. Thin films can consist of metal, semiconductors, and dielectrics, providing them with different properties. These properties translate to benefits such as electrical insulation, optical transmission, and corrosion resistance, that can be used to improve substrate performance. This article explores the processes of thin film deposition, along with its types, parameters, benefits, drawbacks, and applications.