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Introducing the Connectivity and Sensing in Harsh Environments Series: Advancements in aerospace, defense, construction, power systems, automobiles, nuclear reactors, and various other fields have made it necessary for systems engineers to ensure reliable performance in the harshest environments.

Connectivity and Sensing Technologies Proven in the Harshest Environments

Engineers at EPFL have developed a method for reading several qubits – the smallest unit of quantum data – at the same time. Their method paves the way to a new generation of even more powerful quantum computers.

Making quantum computers even more powerful

Silicon wafers are thin slices of highly pure crystalline Silicon, used in the production of integrated circuits. This article delves into the fascinating world of silicon wafers, unraveling their production process, unique properties, and the wide range of applications that make them indispensable.

Silicon Wafers: Production, Properties and Application

The article covers the basics of TinyML, a technology that improves the privacy, energy efficiency, affordability and reliability of devices utilising artificial intelligence. Be a part of TinyML for good, an online event and showcase of ideas that aims at exploring the topic in more detail.

TinyML for Good: where machine learning meets edge computing

Understanding forward bias vs reverse bias configurations in diodes, exploring the theoretical aspects, implementation, applications, and considerations while noting the key differences between forward bias vs reverse bias operating modes in diodes.

Forward Bias, Reverse Bias and their effects on Diodes

In this episode, we talk about a blind cane from Stanford University that borrows self-driving tech to increase the mobility of visually-impaired people by 20% as well as an effort from Texas A&M to develop enhanced touchscreens which will enable users to feel textures on their smart devices.

Podcast: The Tesla of Blind Canes

Profiles